Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18217898
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Filing Dt:
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07/03/2023
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Publication #:
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Pub Dt:
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02/01/2024
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Inventors:
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Ankur AGGARWAL, Jeremy Matthew Plunkett
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Title:
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VIA FORMED IN A WAFER USING A FRONT-SIDE AND A BACK-SIDE PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2962 BUNKER HILL, LN. #200 |
SANTA CLARA, CALIFORNIA 95054 |
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RAY QUINNEY & NEBEKER |
36 SOUTH STATE STREET |
SUITE 1400 |
SALT LAKE CITY, UT 84111 |
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09/23/2024 04:33 AM
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