Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17918038
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Filing Dt:
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10/10/2022
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Publication #:
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Pub Dt:
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02/01/2024
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Inventors:
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Yunzhi LING, Siliang HE, Jianguo MA, Yuhao BI, Xingyu LIU, Chuan HU, Zhitao CHEN
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Title:
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SUBSTRATE BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 363 CHANGXING ROAD, TIANHE DISTRICT, GUANGZHOU |
| GUANGDONG, CHINA 510650 |
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| DICKE, BILLIG & CZAJA |
| FIFTH STREET TOWERS |
| 100 SOUTH FIFTH STREET, SUITE 2250 |
| MINNEAPOLIS, 55402 UNITED STATES |
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05/26/2024 12:28 PM
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