Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17874063
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Filing Dt:
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07/26/2022
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Publication #:
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Pub Dt:
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02/01/2024
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Inventors:
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Neng-Tai SHIH, Hsiao-Lei WANG, Kao-Mei SUNG
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Title:
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Epitaxial Substrate Having a 2D Material Interposer, Method for Manufacturing the Epitaxial Substrate, and Device Prepared from the Epitaxial Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14F., NO. 28, LN. 132, JILIN RD., LUZHU DIST. |
| TAOYUAN, TAIWAN |
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| CHEYANG CHEN |
| 17700 CASTLETON ST, SUITE 373 |
| CITY OF INDUSTRY, CA 91748 |
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