Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17967378
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Filing Dt:
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10/17/2022
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Publication #:
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Pub Dt:
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02/08/2024
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Inventors:
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CHIH-HAO LIAO, HSIN-YEH HUANG, SHU-HAN WU
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Title:
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CHIP PACKAGE STRUCTURE AND PACKAGE MODULE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F, NO.94, BAOZHONG RD., XINDIAN DIST. |
| NEW TAIPEI CITY, TAIWAN 231 |
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| LI & CAI INTELLECTUAL PROPERTY (USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
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