Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17964868
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Filing Dt:
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10/12/2022
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Publication #:
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Pub Dt:
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02/08/2024
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Inventors:
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HSIN-YEH HUANG, CHIH-HAO LIAO, SHU-HAN WU
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Title:
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CHIP PACKAGE STRUCTURE AND ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE MODULE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8F, NO.94, BAOZHONG RD., XINDIAN DIST., |
NEW TAIPEI CITY, TAIWAN 231 |
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LI & CAI INTELLECTUAL PROPERTY OFFICE |
9F, NO. 69, SEC. 2 DUNHUA S. RD |
DA'AN DISTRICT |
TAIPEI, 106 TAIWAN |
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09/25/2024 03:52 PM
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