Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17817738
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Filing Dt:
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08/05/2022
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Publication #:
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Pub Dt:
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02/08/2024
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Inventors:
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Der-Chyang Yeh, Sung-Feng Yeh, Jian-Wei Hong
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Title:
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Integrated Circuit Package and Method of Forming the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL LLP/TSMC |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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06/25/2024 02:56 PM
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