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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18489814
Filing Dt:
10/18/2023
Publication #:
Pub Dt:
02/08/2024
Inventors:
Yi-Lin Tsai, I-Hsuan Peng, Wen-Sung Hsu, Yi-Jou Lin
Title:
SEMICONDUCTOR PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
065274/0329Recorded: 10/18/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/11/2021
Exec Dt:
03/11/2021
Exec Dt:
03/10/2021
Exec Dt:
03/10/2021
Assignee:
NO.1, DUSING 1ST RD.
HSINCHU SCIENCE PARK
HSINCHU CITY, TAIWAN 30078
Correspondent:
USHA K. MUNUKUTLA-PARKER
WOLF, GREENFIELD & SACKS, P.C.
600 ATLANTIC AVENUE
BOSTON, MA 02210-2206

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