Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18489814
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Filing Dt:
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10/18/2023
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Publication #:
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Pub Dt:
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02/08/2024
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Inventors:
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Yi-Lin Tsai, I-Hsuan Peng, Wen-Sung Hsu, Yi-Jou Lin
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1, DUSING 1ST RD. |
| HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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| USHA K. MUNUKUTLA-PARKER |
| WOLF, GREENFIELD & SACKS, P.C. |
| 600 ATLANTIC AVENUE |
| BOSTON, MA 02210-2206 |
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