Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17766550
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Filing Dt:
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04/05/2022
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Publication #:
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Pub Dt:
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02/15/2024
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Inventors:
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Seiichi YAMAZAKI, Toshihiro HIGASHIKAWA, Hitoshi HIRAI
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Title:
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MOLDED ARTICLE, ELECTRICAL PRODUCT AND METHOD FOR PRODUCING MOLDED ARTICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3, MIBU HANAI-CHO, NAKAGYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 6048551 |
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| MILLEN, WHITE, ZELANO & BRANIGAN - AMB |
| 2200 CLARENDON BLVD. |
| SUITE 1400 |
| ARLINGTON, VA 22201 |
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05/02/2024 09:25 AM
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