Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18487581
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Filing Dt:
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10/16/2023
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Publication #:
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Pub Dt:
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02/15/2024
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Inventors:
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Kwang-Ho KWON, No Min LIM, Byung Jun LEE
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Title:
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INDUCTIVELY COUPLED PLASMA ETCHING APPARATUS, AND INDUCTIVELY COUPLED PLASMA ETCHING METHOD USING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2511, SEJONG-RO, JOCHIWON-EUP |
| SEJONG-SI, KOREA, REPUBLIC OF 30019 |
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| SUGHRUE |
| 2000 PENNSLVANIA AVENUE, NW |
| 9000 |
| WASHINGTON, DC 20006 |
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06/20/2024 09:11 AM
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