Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18363645
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Filing Dt:
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08/01/2023
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Publication #:
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Pub Dt:
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02/15/2024
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Inventors:
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KEE-WEI CHUNG, RU-YI CAI
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10F.-1, NO.1, TAIYUAN 1ST ST., ZHUBEI CITY |
| HSINCHU COUNTY, TAIWAN 30288 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 1100 QUAIL STREET, SUITE 202 |
| NEWPORT BEACH, CA 92660 |
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