Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17819639
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Filing Dt:
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08/15/2022
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Publication #:
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Pub Dt:
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02/15/2024
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Inventor:
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Jen-Yuan Chang
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Title:
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INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-TO-DIELECTRIC BONDING QUALITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| KILPATRICK TOWNSEND & STOCKTON LLP |
| 1100 PEACHTREE STREET, NE SUITE 2800 |
| ATLANTA, GA 30309 |
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