Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18494163
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Filing Dt:
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10/25/2023
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Publication #:
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Pub Dt:
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02/15/2024
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Inventors:
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Eric Miller, Christian M. Boemler, Justin Gordon Adams Wehner, Drew Fairbanks et al
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Title:
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INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 870 WINTER STREET |
| WALTHAM, MASSACHUSETTS 02451-1449 |
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| MUNCK WILSON MANDALA |
| P.O. DRAWER 800889 |
| DALLAS, TX 75380 |
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09/27/2024 06:32 AM
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