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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
04/30/2024
Application #:
18039610
Filing Dt:
05/31/2023
Publication #:
Pub Dt:
02/15/2024
Inventors:
Wei NI, Tetsuya HAYASHI, Keiichiro NUMAKURA, Toshiharu MARUI, Ryouta TANAKA et al
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
063811/0936Recorded: 05/31/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Exec Dt:
03/27/2023
Assignees:
2, TAKARA-CHO, KANAGAWA-KU
YOKOHAMA-SHI, KANAGAWA, JAPAN 221-0023
122-122 BIS AVENUE DU GÉNÉRAL LECLERC
BOULOGNE-BILLANCOURT, FRANCE 92100
Correspondent:
FOLEY & LARDNER LLP
3000 K STREET N.W.
SUITE 600
WASHINGTON, DC 20007-5109

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