Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18267633
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Filing Dt:
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06/15/2023
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Publication #:
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Pub Dt:
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02/22/2024
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Inventors:
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Ryosuke HARADA, Koichiro OKAMOTO
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Title:
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HOLLOW RESIN PARTICLES USED IN RESIN COMPOSITION FOR SEMICONDUCTOR MEMBER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-4, NISHITENMA 2-CHOME, KITA-KU, OSAKA-SHI |
OSAKA, JAPAN 5308565 |
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WENDEROTH, LIND & PONACK L.L.P |
1025 CONNECTICUT AVENUE NW |
SUITE 500 |
WASHINGTON, DC 20036 |
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05/21/2024 04:59 AM
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