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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17895916
Filing Dt:
08/25/2022
Publication #:
20240071848
Pub Dt:
02/29/2024
Inventors:
Haobo CHEN, Srinivas V. PIETAMBARAM, Gang DUAN, Ziyin LIN, Bohan SHAN, Brandon C. MARIN et al
Title:
THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES
Assignment: 1
Reel/Frame:
063149/0245Recorded: 03/23/2023Pages: 35
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SHAN, BOHAN
Exec Dt:
08/09/2022
CHEN, HAOBO
Exec Dt:
08/24/2022
MARIN, BRANDON C.
Exec Dt:
08/05/2022
PIETAMBARAM, SRINIVAS V.
Exec Dt:
08/05/2022
NIE, BAI
Exec Dt:
08/09/2022
DUAN, GANG
Exec Dt:
08/05/2022
ARRINGTON, KYLE
Exec Dt:
08/09/2022
LIN, ZIYIN
Exec Dt:
08/09/2022
FENG, HONGXIA
Exec Dt:
08/20/2022
BAI, YIQUN
Exec Dt:
08/16/2022
GUO, XIAOYING
Exec Dt:
08/16/2022
XU, DINGYING DAVID
Exec Dt:
08/07/2022
DARMAWIKARTA, KRISTOF
Exec Dt:
08/16/2022
NAD, SUDDHASATTWA
Exec Dt:
08/30/2022
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JUSTIN K. BRASK
1211 SW 5TH AVENUE, STE. 1600
PORTLAND, OR 97204

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