Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18304527
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Filing Dt:
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04/21/2023
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Publication #:
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Pub Dt:
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02/29/2024
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Inventors:
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Chih Hsin YANG, Yen Lian LAI, Dian-Hau CHEN, Mao-Nan WANG
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Title:
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THROUGH VIA WITH GUARD RING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HAYNES AND BOONE, LLP |
| 2323 VICTORY AVENUE |
| DALLAS, TX 75219 |
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05/28/2024 07:39 PM
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