Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17898777
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Filing Dt:
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08/30/2022
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Publication #:
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Pub Dt:
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02/29/2024
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Inventors:
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Yu-Sheng Lin, Chen-Nan Chiu, Jyun-Lin Wu, Yao-Chun Chuang
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Title:
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SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROVED RELIABILITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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FAY SHARPE LLP |
1228 EUCLID AVE |
FLOOR 5 |
CLEVELAND, OH 44115 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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FAY SHARPE LLP |
1228 EUCLID AVENUE, 5TH FLOOR |
THE HALLE BUILDING |
CLEVELAND, OH 44115 |
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09/24/2024 09:47 AM
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