Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17896030
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Filing Dt:
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08/25/2022
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Publication #:
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Pub Dt:
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02/29/2024
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Inventors:
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Kelvin Tan Aik Boo, Hong Wan Ng, Seng Kim Ye, Ling Pan, See Hiong Leow
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Title:
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EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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| PERKINS COIE LLP - MICRON PATENT-SEA |
| PO BOX 1247 |
| SEATTLE, WA 98111-1247 |
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05/11/2024 01:43 PM
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