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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18155691
Filing Dt:
01/17/2023
Publication #:
Pub Dt:
03/07/2024
Inventors:
Hyun Sik NOH, Eun Ae JUNG, Jooyong KIM, Byeong Il YANG, Jae Chul LEE, Dong Kyun LEE et al
Title:
ATOMIC LAYER ETCHING METHOD USING LIGAND EXCHANGE REACTION
Assignment: 1
Reel/Frame:
062400/0563Recorded: 01/17/2023Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/05/2023
Exec Dt:
01/05/2023
Exec Dt:
01/05/2023
Exec Dt:
01/05/2023
Exec Dt:
01/09/2023
Exec Dt:
01/09/2023
Exec Dt:
01/09/2023
Exec Dt:
01/09/2023
Exec Dt:
01/09/2023
Assignees:
2091, GYEONGCHUNG-DAERO, BUBAL-EUB
GYEONGGI-DO
ICHEON-SI, KOREA, REPUBLIC OF 17336
261 WONNAMSANDAN-RO, WONNAM-MYEON
CHUNGCHEONGBUK-DO
EUMSEONG-GUN, KOREA, REPUBLIC OF 27721
Correspondent:
AGORA LAW GROUP, PLLC
22722 29TH DR SE
SUITE 100
BOTHELL, WA 98021
Assignment: 2
Reel/Frame:
066500/0751Recorded: 02/20/2024Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/29/2024
Assignee:
FRANKFURTER STRASSE 250
DARMSTADT, GERMANY 64293
Correspondent:
JAMES KIM
3400 188TH ST SW
SUITE 695
LYNNWOOD, WA 98037

Search Results as of: 06/21/2024 03:41 AM
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