Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18241237
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Filing Dt:
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09/01/2023
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Publication #:
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Pub Dt:
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03/07/2024
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Inventors:
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Chang Goo KANG, Jeong Min PARK, Su Jin KIM
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Title:
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SEMICONDUCTOR CHIP ALIGNMENT APPARATUS AND METHOD FOR PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 111, DAEDEOK-DAERO 989BEON-GIL, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 34057 |
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| HAUPTMAN HAM, LLP |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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