Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18139535
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Filing Dt:
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04/26/2023
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Publication #:
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Pub Dt:
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03/07/2024
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Inventor:
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Myung Sam KANG
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Title:
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SEMICONDUCTOR PACKAGE WITH ORGANIC INTERPOSER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 16677 |
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| SUGHRUE MION, PLLC |
| 2000 PENNSYLVANIA AVENUE, N.W. |
| SUITE 9000 |
| WASHINGTON, DC 20006 |
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