Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17930304
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Filing Dt:
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09/07/2022
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Publication #:
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Pub Dt:
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03/07/2024
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Inventors:
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Kelvin Tan Aik Boo, Wen Wei Lum, Hong Wan Ng
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Title:
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MICROELECTRONIC DEVICE PACKAGES AND RELATED METHODS AND SYSTEMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY, MAILSTOP 1-507 |
| BOISE, IDAHO 83707-0006 |
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| TRASKBRITT |
| 230 SOUTH 500 EAST, SUITE 300 |
| SALT LAKE CITY, UT 84102 |
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