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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17929973
Filing Dt:
09/06/2022
Publication #:
Pub Dt:
03/07/2024
Inventors:
Jun Rong Tan, Keen Wah Chow, Hao Ting Teo, Hoong Shing Wong
Title:
TECHNIQUES TO MANUFACTURE INTER-LAYER VIAS
Assignment: 1
Reel/Frame:
061018/0242Recorded: 09/07/2022Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/24/2022
Exec Dt:
08/24/2022
Exec Dt:
08/25/2022
Exec Dt:
09/03/2022
Assignee:
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83716-9632
Correspondent:
HOLLAND & HART LLP
P.O. BOX 11583
SALT LAKE CITY, UT 84147

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