Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18487068
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Filing Dt:
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10/14/2023
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Publication #:
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Pub Dt:
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03/07/2024
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Inventors:
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Akira YAMAUCHI, Tadatomo SUGA
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Title:
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BONDING SYSTEM AND BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 77, KISSHOIN-ISHIHARANISHI-MACHI, MINAMI-KU, KYOTO-SHI |
| KYOTO, JAPAN 601-8366 |
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| 6-3, HIGASHINAKANO 3-CHOME, NAKANO-KU |
| TOKYO, JAPAN 164-0003 |
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| ASLAN LAW, P.C. |
| P.O. BOX 3268, 8409 LEE HWY |
| MERRIFIELD, VA 22116-9998 |
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05/09/2024 06:41 PM
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