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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	18242758	Filing Dt:	09/06/2023
Publication #:	20240079524	Pub Dt:	03/07/2024
Inventors:	Wei-Jen HSUEH, Shih-Chang LEE, Kuo-Feng HUANG, Wen-Luh LIAO, Jiong-Chaso SU, Yi-Chieh LIN et al
Title:	SEMICONDUCTOR DEVICE

Assignment: 1

Reel/Frame:

Recorded: 09/07/2023

Pages: 22

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

Exec Dt:

08/24/2023

Exec Dt:

08/11/2023

Exec Dt:

08/17/2023

Exec Dt:

08/14/2023

Exec Dt:

08/14/2023

Exec Dt:

08/14/2023

Exec Dt:

08/14/2023

Assignee:

21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK

HSINCHU, TAIWAN 300

Correspondent:

DITTHAVONG, STEINER, & MLOTKOWSKI

201 NORTH UNION STREET

SUITE 110

ALEXANDRIA, VA 22314

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