Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18367478
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Filing Dt:
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09/13/2023
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Publication #:
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Pub Dt:
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03/14/2024
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Inventors:
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Yenheng CHEN, Chengchung LIN
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Title:
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FAN-OUT SYSTEM-LEVEL PACKAGING STRUCTURE AND PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9 DONGSHENG WEST ROAD |
| JIANGYIN CITY, JIANGSU PROVINCE, CHINA 214437 |
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| EMILY SHU |
| 116 ARCADIA AVE |
| SANTA CLARA, CA 95051 |
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06/14/2024 01:40 AM
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