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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18515912
Filing Dt:
11/21/2023
Publication #:
Pub Dt:
03/14/2024
Inventors:
Yi-Huan Chen, Chien-Chih Chou, Alexander Kalnitsky, Kong-Beng Thei, Ming Chyi Liu et al
Title:
BOUNDARY DESIGN FOR HIGH-VOLTAGE INTEGRATION ON HKMG TECHNOLOGY
Assignment: 1
Reel/Frame:
065634/0859Recorded: 11/21/2023Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/24/2020
Exec Dt:
03/24/2020
Exec Dt:
04/08/2020
Exec Dt:
03/24/2020
Exec Dt:
03/25/2020
Exec Dt:
04/09/2020
Exec Dt:
04/01/2020
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
ESCHWEILER & POTASHNIK, LLC
195 S. MAIN ST., SUITE 400
AKRON, OH 44308

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