Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18491613
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Filing Dt:
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10/20/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Inventors:
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Noriaki Takagi, Yuuta Terao, Daisuke Watanabe, Masakuni Takagi, Yuusuke Nagatani et al
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Title:
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FILLER-LOADED HIGH THERMAL CONDUCTIVE DISPERSION LIQUID COMPOSITION HAVING EXCELLENT SEGREGATION STABILITY, METHOD FOR PRODUCING SAID DISPERSION LIQUID COMPOSITION, FILLER-LOADED HIGH THERMAL CONDUCTIVE MATERIAL USING SAID DISPERSION LIQUID COMPOSITION, METHOD FOR PRODUCING SAID MATERIAL, AND MOLDED ARTICLE OBTAINED USING SAID MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21-1, AZA-HORITA |
| OHBATA-CHO, OKAZAKI-SHI |
| AICHI, JAPAN 4443502 |
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| FOX ROTHSCHILD LLP |
| PRINCETON PIKE CORPORATE CENTER |
| 997 LENOX DRIVE, BLDG. #3 |
| LAWRENCEVILLE, NJ 08648-2311 |
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