Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18196410
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Filing Dt:
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05/11/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Inventor:
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Sheng-Huang Lin
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Title:
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THERMAL MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7F.-3, NO. 24, WUCYUAN 2ND RD. |
| SINJHUANG DISTRICT |
| NEW TAIPEI CITY, TAIWAN |
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| ASIA VITAL COMPONENTS CO., LTD |
| 7F, NO. 283, SEC 2, FUSHING S. RD. |
| DAAN DISTRICT |
| TAIPEI, 106 TAIWAN |
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