Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18172240
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Filing Dt:
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05/17/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Inventors:
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Chun-Yuan CHEN, Huan-Chieh SU, Ching-Wei TSAI, Shang-Wen CHANG, Yi-Hsun CHIU et al
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Title:
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DEVICE WITH THROUGH VIA AND RELATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SEED IP LAW GROUP LLP |
| 701 5TH AVE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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05/28/2024 03:14 AM
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