Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18513832
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Filing Dt:
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11/20/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Inventors:
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Deog Soo KIM, Tae Ryong KIM
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Title:
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Semiconductor Module Having Double Sided Heat Dissipation Structure and Method for Fabricating the Same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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222, TECHNO 2-RO, YUSEONG-GU |
DAEJEON, KOREA, REPUBLIC OF 34027 |
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ROTHWELL, FIGG, ERNST & MANBECK, P.C. |
901 NEW YORK AVENUE, N.W. |
SUITE 900 EAST |
WASHINGTON, DC 20001 |
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09/22/2024 07:20 AM
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