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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	18151663	Filing Dt:	01/09/2023
Publication #:	20240096830	Pub Dt:	03/21/2024
Inventors:	Yu-Yi Huang, Yu-Hung Lin, Chen Chen, Shih-Peng Tai, Wei-Ming Wang, Kuo-Chung Yee
Title:	Adding Sealing Material to Wafer edge for Wafer Bonding

Assignment: 1

Reel/Frame:

062312/0420

Recorded: 01/09/2023

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

HUANG, YU-YI

Exec Dt:

09/18/2022

LIN, YU-HUNG

Exec Dt:

09/17/2022

WANG, WEI-MING

Exec Dt:

09/18/2022

CHEN, CHEN

Exec Dt:

09/18/2022

TAI, SHIH-PENG

Exec Dt:

09/18/2022

YEE, KUO-CHUNG

Exec Dt:

09/18/2022

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK

HSINCHU, TAIWAN 300-78

Correspondent:

SLATER MATSIL, LLP

17950 PRESTON RD., SUITE 1000

DALLAS, TX 75252

Assignment: 2

Reel/Frame:

062352/0207

Recorded: 01/11/2023

Pages: 7

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE TYPOGRAPHICAL ERROR IN THE APPLICATION NUMBER PREVIOUSLY RECORDED AT REEL: 062312 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

HUANG, YU-YI

Exec Dt:

09/18/2022