Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18149806
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Filing Dt:
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01/04/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Inventors:
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Chih-Wei Wu, Ching-Feng Yang, Ying-Ching Shih, An-Jhih Su, Wen-Chih Chiou
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP - TSMC |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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05/29/2024 06:14 PM
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