Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18450664
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Filing Dt:
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08/16/2023
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Publication #:
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Pub Dt:
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03/21/2024
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Inventors:
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Justin S. Brockman, Fang Ou, Lina He, Dmitry S. Sizov, Lei Zhang
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Title:
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Method of Transferring Patterned Micro-LED Die onto a Silicon Carrier for Wafer-to-Wafer Hybrid Bonding to a CMOS Backplane
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE APPLE PARK WAY |
CUPERTINO, CALIFORNIA 95014 |
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AIKIN & GALLANT, LLP |
445 S. SAN ANTONIO ROAD, SUITE 202 |
LOS ALTOS, CA 94022 |
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06/21/2024 04:58 AM
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