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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	18306702	Filing Dt:	04/25/2023
Publication #:	20240113032	Pub Dt:	04/04/2024
Inventors:	Kai-Fung CHANG, Chin-Wei LIANG, Sheng-Feng WENG, Ming-Yu YEN, Cheyu LIU, Hung-Chih CHEN et al
Title:	PACKAGED INTERCONNECT STRUCTURES

Assignment: 1

Reel/Frame:

066520/0919

Recorded: 02/21/2024

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CHANG, KAI-FUNG

Exec Dt:

02/14/2024

LIANG, CHIN-WEI

Exec Dt:

11/20/2023

WENG, SHENG-FENG

Exec Dt:

11/23/2023

YEN, MING-YU

Exec Dt:

11/20/2023

LIU, CHEYU

Exec Dt:

12/14/2023

CHEN, HUNG-CHIH

Exec Dt:

11/23/2023

LEI, YI-YANG

Exec Dt:

11/20/2023

HSIEH, CHING-HUA

Exec Dt:

11/20/2023

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

8, LI-HSIN RD. 6

HSINCHU SCIENCE PARK

HSINCHU, TAIWAN 300-78

Correspondent:

HARRITY & HARRITY LLP

11350 RANDOM HILLS ROAD

SUITE 600

FAIRFAX, VA 22030

Search Results as of: 05/30/2024 03:30 PM

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