Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18166109
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Filing Dt:
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02/08/2023
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Publication #:
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Pub Dt:
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04/04/2024
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Inventors:
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Yu-Hung LIN, Chih-Hao YU, Pei-Hsuan LO, Wei-Ming WANG, PaoTai HUANG, Shih-Peng TAI
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Title:
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METHODS FOR FORMING SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| MCCLURE, QUALEY & RODACK LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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05/28/2024 02:16 PM
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