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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
18182552
Filing Dt:
03/13/2023
Publication #:
Pub Dt:
04/11/2024
Inventors:
Oseob JEON, Dongwook KANG, Seungwon IM, Jihwan KIM
Title:
INTEGRATED SUBSTRATES AND RELATED METHODS
Assignment: 1
Reel/Frame:
062960/0460Recorded: 03/13/2023Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/13/2023
Exec Dt:
03/13/2023
Exec Dt:
03/13/2023
Exec Dt:
03/13/2023
Assignee:
5701 N. PIMA ROAD
SCOTTSDALE, ARIZONA 85250
Correspondent:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD
SCOTTSDALE, AZ 85250
Assignment: 2
Reel/Frame:
065402/0293Recorded: 05/09/2023Pages: 10
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/19/2023
Assignee:
60 WALL STREET
NEW YORK, NEW YORK 10005
Correspondent:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD
SCOTTSDALE, AZ 85250
Assignment: 3
Reel/Frame:
065566/0488Recorded: 11/14/2023Pages: 7
Conveyance:
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 064502, FRAME 0293
Assignor:
Exec Dt:
11/13/2023
Assignee:
5005 EAST MCDOWELL ROAD, MAILDROP A700
PHOENIX, ARIZONA 85008
Correspondent:
JUSTINE LU/WHITE & CASE LLP
555 SOUTH FLOWER STREET, SUITE 2700
LOS ANGELES, CA 90071

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