Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18225944
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Filing Dt:
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07/25/2023
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Publication #:
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Pub Dt:
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04/11/2024
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Inventors:
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Yingshi Tang, Yingying Wang, Padam Jain, Emad Samadiani et al
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Title:
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Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1600 AMPHITHEATRE PARKWAY |
| MOUNTAIN VIEW, CALIFORNIA 94043 |
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| LERNER DAVID LLP |
| 20 COMMERCE DR. |
| CRANFORD, NJ 07016 |
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