Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18398120
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Filing Dt:
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12/27/2023
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Publication #:
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Pub Dt:
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04/18/2024
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Inventors:
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Hong Wan Ng, Chin Hui Chong, Hem P. Takiar, Seng Kim Ye, Kelvin Tan Aik Boo
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Title:
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SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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| PERKINS COIE LLP - MICRON PATENT-SEA |
| PO BOX 1247 |
| SEATTLE, WA 98111-1247 |
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