Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17926115
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Filing Dt:
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11/17/2022
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Publication #:
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Pub Dt:
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04/25/2024
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Inventors:
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Sung Wook CHUN, Bo Mook CHUNG, Nak Eun KO, Dea Geun KIM, Ju Yong SIM
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Title:
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LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 30, NAMDONGDONG-RO 153BEON-GIL NAMDONG-GU |
| INCHEON, KOREA, REPUBLIC OF 21690 |
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| STIP LAW GROUP, LLC |
| 40 W. CHESAPEAKE AVE, SUITE 506 |
| TOWSON, MD 21204 |
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