Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18112590
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Filing Dt:
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02/22/2023
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Publication #:
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Pub Dt:
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04/25/2024
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Inventors:
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Chuan HU, Wei ZHENG, Yingqiang YAN, Yao WANG, Zhitao CHEN
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Title:
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MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION PLATE AND PREPARATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 363 CHANGXING ROAD, TIANHE DISTRICT |
| GUANGZHOU, GUANGDONG, CHINA 510650 |
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| GUNTHER J. EVANINA |
| 2410 WOODLAKE DRIVE |
| SUITE 420 |
| OKEMOS, MI 48864 |
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