Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18342397
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Filing Dt:
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06/27/2023
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Publication #:
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Pub Dt:
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05/02/2024
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Inventors:
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Dea Geun KIM, Bo Mook CHUNG, Sung Wook CHUN, Nak Eun KO
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Title:
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LEVELER AND ELECTROPLATING COMPOSITION FOR FILLING VIA HOLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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30, NAMDONGDONG-RO 153BEON-GIL, NAMDONG-GU |
INCHEON, KOREA, REPUBLIC OF 21690 |
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STIP LAW GROUP, LLC |
40 W. CHESAPEAKE AVE, SUITE 506 |
TOWSON, MD 21204 |
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06/24/2024 02:18 AM
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