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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18406784
Filing Dt:
01/08/2024
Publication #:
Pub Dt:
05/02/2024
Inventors:
Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM et al
Title:
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
Assignment: 1
Reel/Frame:
066052/0606Recorded: 01/08/2024Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/23/2008
Exec Dt:
12/23/2008
Exec Dt:
12/23/2008
Exec Dt:
01/02/2009
Exec Dt:
12/23/2008
Exec Dt:
12/23/2008
Exec Dt:
12/23/2008
Exec Dt:
12/20/2008
Exec Dt:
12/23/2008
Assignee:
2045 E. TECHNOLOGY CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
LAW OFFICE OF KEVIN B JACKSON
6315 E CACTUS WREN RD
PARADISE VALLEY, AZ 85253-8006
Assignment: 2
Reel/Frame:
066223/0796Recorded: 01/08/2024Pages: 43
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/19/2019
Assignee:
491B RIVER VALLEY ROAD
VALLEY POINT #12-03, SINGAPORE 248373
Correspondent:
LAW OFFICE OF KEVIN B JACKSON
6315 E CACTUS WREN RD
PARADISE VALLEY, AZ 85253-8006

Search Results as of: 11/11/2024 01:34 AM
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