Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17975662
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Filing Dt:
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10/28/2022
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Publication #:
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Pub Dt:
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05/02/2024
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Inventors:
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Bok Eng CHEAH, Jenny Shio Yin ONG, Vijay KASTURI, Jackson Chung Peng KONG et al
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Title:
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ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FORMING THEREOF
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE THE APPLICATION NUMBER PREVIOUSLY RECORDED AT REEL: 061606 FRAME: 0418. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2200 MISSION COLLEGE BLVD |
| SANTA CLARA, CALIFORNIA 95054 |
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| VIERING, JENTSCHURA & PARTNER MBB |
| C/O 444 BRICKELL AVENUE |
| SUITE 700 |
| MIAMI, FL 33131 |
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