Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18165754
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Filing Dt:
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02/07/2023
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Publication #:
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Pub Dt:
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05/02/2024
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Inventors:
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Yu-Chung Lai, Hsiang-Ku Shen, Wen-Chiung Tu, Dian-Hau Chen, Tzu-Ting Liu, Chen-Chiu Huang et al
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Title:
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VIA WITH SACRIFICIAL STRESS BARRIER RING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, |
| HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| LORENZ & KOPF, LLP (TSMC) |
| 7501 EAST MCCORMICK PARKWAY |
| SUITE 105 SOUTH |
| SCOTTSDALE, AZ 85258 |
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06/18/2024 03:04 PM
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