Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18384396
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Filing Dt:
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10/27/2023
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Publication #:
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Pub Dt:
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05/02/2024
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Inventors:
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Kuan-Neng CHEN, Zhong-Jie HONG, Chih-I CHO, Ming-Wei WENG, Chih-Han CHEN, Chiao-Yen WANG et al
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Title:
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PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUTTERING TARGET MAKING THE SAME, SEMICONDUCTOR BONDING STRUCTURE AND SEMICONDUCTOR BONDING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, GONGYE 3RD RD., ANNAN DIST., |
TAINAN, TAIWAN |
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WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
8230 BOONE BLVD, SUITE 405 |
VIENNA, VA 22182 |
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06/20/2024 02:39 AM
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