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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18284403
Filing Dt:
09/27/2023
Publication #:
Pub Dt:
05/09/2024
Inventor:
Hiroyuki NIIKURA
Title:
RESIN COMPOSITION AND MOLDED PRODUCT
Assignment: 1
Reel/Frame:
065049/0420Recorded: 09/27/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/10/2023
Assignee:
15TH FLOOR, TOHO HIBIYA BUILDING, 1-2-2, YURAKUCHO, CHIYODA-KU
TOKYO, JAPAN 1000006
Correspondent:
ROY D. GROSS
101 MERRITT 7
SUITE 300
NORWALK, CT 06851

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