Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17983226
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Filing Dt:
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11/08/2022
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Publication #:
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Pub Dt:
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05/09/2024
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Inventors:
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Vipul MEHTA, Jigneshkumar PATEL, Ziyin LIN, Jonas CROISSANT, Dingying XU et al
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Title:
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BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| JUSTIN K. BRASK |
| 1211 SW 5TH AVENUE, STE. 1600 |
| PORTLAND, OR 97204 |
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05/27/2024 01:45 PM
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