Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18303137
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Filing Dt:
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04/19/2023
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Publication #:
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Pub Dt:
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05/09/2024
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Inventors:
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Harry-HakLay CHUANG, Wei-Cheng WU, Chung-Jen HUANG, Yung Chun TU, Chien Lin LIU et al
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Title:
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SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| HARRITY & HARRITY, LLP |
| 11350 RANDOM HILLS ROAD |
| SUITE 600 |
| FAIRFAX, VA 22030 |
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