Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18367609
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Filing Dt:
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09/13/2023
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Publication #:
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Pub Dt:
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05/09/2024
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Inventors:
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SHENG-FU HUANG, SHING-YIH SHIH
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Title:
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SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.98, NANLIN RD., TAISHAN DIST. |
NEW TAIPEI CITY, TAIWAN 243 |
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XUAN ZHANG |
2410 MOUNTAIN BROOK DR |
HACIENDA HEIGHTS, CA 91745 |
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09/28/2024 08:31 AM
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